The thermal resistance test results of TIC800H-ZK thermal conductive material have been released, performs exceptionally well across various thicknesses and under different pressure scenarios 

The special thermal resistance test for the TIC800H-ZK thermal conductive material has been successfully completed. This test was conducted in accordance with the ASTM D5470 standard, using the LW-9389 tester for systematic detection. The aim was to accurately obtain the thermal resistance performance data of this material under different thicknesses and pressure conditions, providing professional data support for its subsequent application selection and performance optimization.

This test was strictly conducted under standardized conditions. The samples were uniformly cut to a size of 25.4*25.4mm. The temperature control of the heating element was stabilized at 80℃. The pressure testing range covered the mainstream application range of 10-100psi. A total of 0.20mm, 0.25mm, 0.30mm, and 0.50mm four common thicknesses of TIC800H-ZK materials were tested throughout the pressure range.

The test results show that the thermal resistance of the TIC800H-ZK thermal conductive material has a significant positive correlation with pressure. At each thickness specification, as the test pressure gradually increased from 10 psi to 100 psi, the thermal resistance of the material showed a continuous downward trend. After the pressure was raised to 70 psi, the change in thermal resistance became more stable, and the performance entered a stable range, demonstrating the thermal conductivity stability of this material under high-pressure conditions.

From the specific data of each thickness, the TIC800H-ZK with a thickness of 0.20mm performed the most outstandingly. At 10psi, its thermal resistance was 0.018℃・in²/W, and it dropped to 0.013℃・in²/W at 70psi. The thermal resistance remained unchanged at 0.013℃・in²/W in the range from 70psi to 100psi. This specification had the lowest thermal resistance value in this test and was suitable for thin application scenarios with extremely high thermal conductivity requirements.

The material with a thickness of 0.25mm had a thermal resistance of 0.019℃・in²/W at 10psi and dropped to 0.014℃・in²/W at 100psi. Its overall performance was balanced. The material with a thickness of 0.30mm had a thermal resistance of 0.015℃・in²/W after 50psi and remained stable at this value up to 100psi. It partially overlapped with the thermal resistance curve of the 0.25mm thickness material, providing flexible selection space for medium-thickness application scenarios. The material with a thickness of 0.50mm, as a thicker specification, had a thermal resistance of 0.021℃・in²/W at 10psi and dropped to 0.015℃・in²/W at 100psi.

It demonstrated excellent thermal conductivity performance in the thick material category and was suitable for working conditions with specific requirements on material thickness.