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제품 상세 정보:
결제 및 배송 조건:
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| Features: | Ultra soft and Naturally tacky needing no furtheradhesive coating | Product name: | Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For Pcb |
|---|---|---|---|
| Keywords: | Thermal Gap Filler Pad | Thickness: | 0.020"(0.5mm)~0.200"(5.00mm) |
| Hardness: | 27±5 Shore 00 | Application: | LED PCB |
| Fire rating: | 94-V0 | Thermal conductivity: | 2.0W/m-K |
Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For Pcb
The TIF500-20-11U is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF500-20-11U is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
Features:
> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
| Typical Properties of TIF500-20-11U Series | ||
| Color | Gray | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer | ****** |
| Thickness | 0.020"(0.5mm)~0.200"(5.0MM) | ASTM D374 |
| Specific Gravity | 2.7g/cc | ASTM D792 |
| Hardness | 35 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ****** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 4.5 MHz | ASTM D150 |
| Volume Resistivity | 1.0X1012 Ohm-meter | ASTM D257 |
| Fire rating | 94-V0 | UL E331100 |
| Thermal conductivity | 2.0W/m-K | ASTM D5470 |
Product Thicknesses: 0.020-inch to 0.200-inch(0.5mm to 5.0mm)
Product Sizes: 8" x 16%(203mm x406mm)
Individual die cut shapesand and custom thickness can be supplied. Please contact us for confirming
Safe disposal method does not require special protection. The storage condition is low temperature and dry, away from openfire and away from direct sunlight.For detailed method, please refer to the product material safety data sheet.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
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This message should include any questions you might have about the products as well as your purchase requests.
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담당자: Dana Dai
전화 번호: 18153789196
