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제품 상세 정보:
결제 및 배송 조건:
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| 제품명: | AI 프로세서 AI 서버용 고성능 열 전도성 6.5W 연질 열 전도성 갭 필러 패드 | 애플리케이션: | AI 프로세서 AI 서버 |
|---|---|---|---|
| 경도: | 35/65 쇼어 00 | 밀도(g/cm3): | 3.4 |
| 키워드: | 부드러운 열 간격 필러 패드 | 다이렉트릭 상수 @ 1MHz: | 7.0MHz |
| 화재 등급: | 94-V0 | 열전도율: | 6.5W/MK |
High Performance Thermally Conductive 6.5W Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers
Company pfofile
The TIF®700NS Series a well-balanced, general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.
Features:
> Good thermal conductive 6.5W
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
Applications:
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers
| Typical Properties of TIF®700NS Series | |||
| Property | Value | Test method | |
| Color | Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.4 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.030 | 0.040~0.200 | ASTM D374 |
| (0.25~0.75) | (1.00~5.00) | ||
| Hardness | 60 Shore 00 | 45 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 7.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 6.5W/m-K | ASTM D5470 | |
| 6.5W/m-K | ISO22007 | ||
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us.
4. We will reply you as soon as possible with Email or online.
담당자: Dana Dai
전화 번호: +86 18153789196
