|
|
제품 상세 정보:
결제 및 배송 조건:
|
| 제품명: | 내장형 시스템에서 열 방출을 강화하고 전자 부품의 수명을 연장하도록 설계된 열 갭 필러 | 건설 및 구성: | 세라믹 충전 실리콘 엘라스토머 |
|---|---|---|---|
| 다이렉트릭 상수 @ 1MHz: | 4.7 | 애플리케이션: | 내장형 시스템에서 열 방출을 강화하고 전자 부품의 수명을 연장합니다. |
| 견본: | 샘플 무료 | 권장 작동 온도(°C): | -40 내지 200C |
| 열전도율 (Ｗ / 마크): | 2.0W/mk | 경도: | 65/45 쇼어 00 |
| 화염 등급: | UL 94 V-0 | 키워드: | 열 갭 필러 |
Thermal Gap Filler Designed to Enhance Heat Dissipation and Extend Lifespan of Electronic Components in Embedded Systems
Products description
TIF®100-20-10S Series is a well-balanced,general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.
Features
>Good thermal conductivity
>Good softness and fillability
>Self-adhesive without the need for additional surface adhesives
>Good insulation performance
Applications
>Home appliance industry
>Power module
>Wearable device
>Solar photovoltaic panel
>LED lighting fixtures
| Typical Properties of TIF®100-20-10S Series | |||
| Property | Value | Test method | |
| Colo | Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 2.65 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 | 45 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant @1MHz | 4.7 | ASTM D150 | |
| Volume Resistivity(Ohm-meter) | ＞1.0X1012 | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity (W/m-K) | 2.0 | ASTM D5470 | |
| 2.0 | ISO22007 | ||
Product Specifications
Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm),with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmx406 mm)
The TIF® series is available in custom shapes andvarious forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:
All products are compliant with UL94 V-0, SGS and ROHS standards.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us.
4. We will reply you as soon as possible with Email or online.
FAQ
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us
4. We will reply you as soon as possible with Email or online
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Exhibition desplay
담당자: Dana Dai
전화 번호: +86 18153789196
