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제품 소개열 갭 필러

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies

중국 Dongguan Ziitek Electronic Materials & Technology Ltd. 인증
중국 Dongguan Ziitek Electronic Materials & Technology Ltd. 인증
열 전도성 패드는 이어 아주 좋은 보고 일하. 우리는 다른 열 전도성 패드를 위한 아무 필요도 지금 없습니다!

—— 피터 Goolsby

나는 2 년간 Ziitek와 협력했었습니다, 그들은 고품질 열 전도성 물자를 제공하고, 때 맞추어 납품은, 그들의 단계 변화 물자를 추천합니다

—— Antonello Sau

좋은 품질, 좋은 서비스. 당신의 팀은 항상 저희에게 도움과 결심을, 우리가 항상 좋은 파트너일 희망 줍니다!

—— Chris Rogers

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Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies

큰 이미지 :  Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies

제품 상세 정보:
원래 장소: 중국, 동관
브랜드 이름: ZIITEK
인증: UL and RoHs
모델 번호: TIF100-30-10S
문서: TIF100-30-10S_Data Sheet.pdf
결제 및 배송 조건:
최소 주문 수량: 1000PCS
가격: 협상 가능
포장 세부 사항: 1000개/가방
배달 시간: 3-5 일
지불 조건: 티/티
공급 능력: 100000/일
상세 제품 설명
제품명: 우수한 부드러움과 열 전도성을 제공하여 전자 어셈블리의 냉각 및 신뢰성을 향상시키는 열 갭 필러 건설 및 구성: 세라믹 충전 실리콘 엘라스토머
다이렉트릭 상수 @ 1MHz: 5.0 애플리케이션: 전자 어셈블리의 냉각 및 신뢰성 향상
견본: 샘플 무료 권장 작동 온도(°C): -40 내지 200C
열전도율 (W / 마크): 3.0W/mK 경도: 65/45 쇼어 00
화염 등급: UL 94 V-0 키워드: 열 갭 필러
밀도: 3.15g/cm³

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies


Products description


TIF®100-30-10S Series is a well-balanced,general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.


Features


 > Good thermal conductivity
 > Moldability for complex parts
 > Soft and compressible for low stress applications
 > Naturally tacky needing no further adhesive coating
 > Available in varies thicknesses

Applications

 > Home appliance industry
 > Power module
 > Wearable device
 > Solar photovoltaic panel
 > LED lighting fixtures

 > Power tools
 > Network communication products
 > Electric vehicle batteries
 > Computer CPU/GPU Cooling
 > New energy vehicle power systems

Key attributes

Typical Properties of TIF®100-30-10S Series
Property Value Test method
Colo Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.15 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 5.0 ASTM D150
Volume Resistivity(Ohm-meter) >1.0X1012  ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity (W/m-K) 3.0 ASTM D5470
3.0 ISO22007


Product Specifications


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16” (406 mm X406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 0

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 1

Company Profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 2

Independent R&D team


Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.


FAQ


Q: How do I place an order? 

A:1. Click the "Sent messages" button to continue with the process. 

2. Fill out the message form by entering a subject line, and message to us.  

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us 

4. We will reply you as soon as possible with Email or online 


Q: How to find a right thermal conductivity for my applications 

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.  


Q: Do you accept custom orders ?  

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .


Exhibition desplay 

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 3


연락처 세부 사항
Dongguan Ziitek Electronic Materials & Technology Ltd.

담당자: Dana Dai

전화 번호: +86 18153789196

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