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good quality thermal padTIF100-18Green

导热硅胶片
January 30, 2021
Category Connection: 열 전도성 패드
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Tags:
#열 전도성 물자 #열으로 전도성 패드 #cpu 열 패드
Brief: Discover the high-quality Green Thermal Gap Filler Pad TIF100-18Green, designed for efficient heat transfer in panels and IGBTs. With a thermal conductivity of 2.0W/mK and a soft, compressible design, this pad ensures optimal performance for various electronic applications.
Related Product Features:
  • Excellent thermal conductivity of 2.0W/mK for efficient heat dissipation.
  • Naturally tacky surface eliminates the need for additional adhesives.
  • Soft and compressible design reduces stress on electronic components.
  • Available in various thicknesses to suit different application needs.
  • RoHS compliant, ensuring environmental and safety standards.
  • Moldable for complex parts, providing versatile usage options.
  • Operates in a wide temperature range from -40°C to 160°C.
  • UL94 V-0 flame rating for enhanced safety in high-heat environments.
자주 묻는 질문:
  • What is the thermal conductivity of the Green Thermal Gap Filler Pad?
    The Green Thermal Gap Filler Pad has a thermal conductivity of 2.0W/mK, ensuring efficient heat transfer for electronic components.
  • Does the pad require additional adhesive for installation?
    No, the pad features a naturally tacky surface, eliminating the need for additional adhesives.
  • What temperature range can the Green Thermal Gap Filler Pad withstand?
    The pad operates effectively in temperatures ranging from -40°C to 160°C, making it suitable for various environments.
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