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결제 및 배송 조건:
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| Features: | High compliance adapts to various pressure application environments | Product name: | Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs |
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| Keywords: | Silicone Thermal Pad | Thermal conductivity: | 6.5W/m-K |
| Thickness: | 0.020~0.20inch(0.50~5.0mmT) | Hardness: | 12 Shore 00 |
| Fire rating: | 94-V0 | Application: | For Advanced Cooling Needs |
Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs
Products Discription
TIF®100-65-11ES Series thermally conductive interface materials are applied to fillthe air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effectively enhances the efficiency and life-time of theheat-generating electroniccomponents.
Features
> Excellent thermal conductivity: 6.5 W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options
Applications
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps
| Typical Properties of TIF®100-65-11ES Series | ||
| Color | Gray | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer | ****** |
| Thickness | 0.020~0.20inch(0.50~5.0mmT) | ASTM D374 |
| Specific Gravity | 3.4g/cc | ASTM D792 |
| Hardness | 12 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | ****** |
| Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
| Dielectric Constant | 7.0 MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X1012 Ohm-meter | ASTM D257 |
| Fire rating | 94-V0 | UL E331100 |
| Thermal conductivity | 6.5W/m-K | ASTM D5470 |
Product Specification
Standard Thickness: 0.02"(0.50 mm)-0.20" (5.00 mm) with increments of 0.01" (0.25 mm).
Standard Size: 16"X16" (406 mmX406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us.
4. We will reply you as soon as possible with Email or online.
담당자: Dana Dai
전화 번호: 18153789196
