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Thermal Silicone Pad 3.2W, Ultra High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

중국 Dongguan Ziitek Electronic Materials & Technology Ltd. 인증
중국 Dongguan Ziitek Electronic Materials & Technology Ltd. 인증
열 전도성 패드는 이어 아주 좋은 보고 일하. 우리는 다른 열 전도성 패드를 위한 아무 필요도 지금 없습니다!

—— 피터 Goolsby

나는 2 년간 Ziitek와 협력했었습니다, 그들은 고품질 열 전도성 물자를 제공하고, 때 맞추어 납품은, 그들의 단계 변화 물자를 추천합니다

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좋은 품질, 좋은 서비스. 당신의 팀은 항상 저희에게 도움과 결심을, 우리가 항상 좋은 파트너일 희망 줍니다!

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Thermal Silicone Pad 3.2W, Ultra High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

Thermal Silicone Pad 3.2W, Ultra High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

큰 이미지 :  Thermal Silicone Pad 3.2W, Ultra High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

제품 상세 정보:
원래 장소: 중국
브랜드 이름: ZIITEK
인증: UL and RoHs
모델 번호: TIF100-32-05U
결제 및 배송 조건:
최소 주문 수량: 1000개
가격: 협상 가능
포장 세부 사항: 1000pcs/bag
배달 시간: 3~5일
공급 능력: 100000pcs/day
상세 제품 설명
제품명: 열 실리콘 패드 3.2W, AI 서버용 초고전도성 갭 필러, GPU 냉각, 인버터 키워드: 열 실리콘 패드
색상: 파란색 열전도율: 3.2 W/m-K
밀도(g/cm3): 3.0 다이렉트릭 상수 @ 1MHz: 3.5
경도: 27 SHORE00 어플리케이션: AI 서버, GPU 냉각, 인버터
견본: 샘플 무료

Thermal Silicone Pad 3.2W, Ultra High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

 

Company Profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


The TIF®100-32-05U Series is an ultra soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with extreme gel grade flexibility to achieve a perfect fit with low stress.It is suitable for solving problems such as large tolerances,uneven surfaces, and susceptibility of precision components to mechanical damage in high-precision assembly.
 
Features:

>  High thermal conductivity: 3.2W/mK

>  Ultra soft and highly compliant
>  Self-adhesive without the need for additional surface adhesives
>  Good insulation performance


Applications

 

>  AI Servers, Inverters, Telecom Devices

>  Power tools
>  Network communication products
>  Electric vehicle batteries Computer CPU/GPU Cooling
>  New energy vehicle power systems

>  Signal communication
>  New energy vehicle
>  Motherboard chip
>  Radiator

 

Typical Properties of TIF®100-32-05U Series
Property Value Test method
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm)

0.010~0.020

(0.25~0.50)

0.030~0.200 (0.75~5.0) ASTM D374
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 3.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 3.2 W/m-K ASTM D5470

3.2 W/m-K

ISO22007

 

Product Specifications


Standard Thickness: 0.010"(0.25 mm)-0.20" (5.00 mm) with increments of 0.010 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)


Component Codes:

 

Reinforcement Fabric: FG (Fiberglass).

Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

 
Thermal Silicone Pad 3.2W, Ultra High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter 0

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

 

FAQ

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

 

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

연락처 세부 사항
Dongguan Ziitek Electronic Materials & Technology Ltd.

담당자: Dana Dai

전화 번호: 18153789196

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