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제품 소개열 전도성 패드

High Performance 10.0W Thermal GAP PAD Materials For Al Servers

중국 Dongguan Ziitek Electronic Materials & Technology Ltd. 인증
중국 Dongguan Ziitek Electronic Materials & Technology Ltd. 인증
열 전도성 패드는 이어 아주 좋은 보고 일하. 우리는 다른 열 전도성 패드를 위한 아무 필요도 지금 없습니다!

—— 피터 Goolsby

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좋은 품질, 좋은 서비스. 당신의 팀은 항상 저희에게 도움과 결심을, 우리가 항상 좋은 파트너일 희망 줍니다!

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High Performance 10.0W Thermal GAP PAD Materials For Al Servers

High Performance 10.0W Thermal GAP PAD Materials For Al Servers

큰 이미지 :  High Performance 10.0W Thermal GAP PAD Materials For Al Servers

제품 상세 정보:
원래 장소: 중국
브랜드 이름: ZIITEK
인증: UL and RoHs
모델 번호: TIF700UU
결제 및 배송 조건:
최소 주문 수량: 1000개
가격: 협상 가능
포장 세부 사항: 1000개/가방
배달 시간: 3~5일
공급 능력: 100000pcs/일
상세 제품 설명
제품명: Al 서버용 고성능 10.0W 열 GAP 패드 소재 키워드: 열 GAP 패드 재료
색상: 회색 열전도율: 10.0W/mK
경도: 30 shore00 밀도(g/cm3): 3.3
다이렉트릭 상수 @ 1MHz: 7.0 애플리케이션: AI 서버, 인버터, 통신기기

High Performance 10.0W Thermal GAP PAD Materials For Al Servers

 

Company Profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


The TIF®700UU Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies,such as large_tolerances,uneven surfaces,and the susceptibility of delicate components to mechanical damage.
 
Features:

>  Good thermal conductivity: 10.0W/mK

>  Super soft and highly compliant
>  Self-adhesive without the need for additional surface adhesives
>  Good insulation performance


Applications

 

> AI Servers, Inverters, Telecom Devices

> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems

> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations

 

Typical Properties of TIF®700UU Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.3 ASTM D792
Thickness Range(inch/mm)

0.030

(0.75)

0.040~0.200 (1.00~5.00) ASTM D374
Hardness 30/10 Shore 00 30/10 Shore 00 ASTM 2240
Recommended Operating Temperature -40 ~ 200℃ ******
Breakdown Voltage(V/mm) ≥4000 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 10.0 W/m-K ASTM D5470

10.0 W/m-K

ISO22007

 

Product Specifications


Standard Thickness: 0.030"(0.75 mm)-0.20" (5.00 mm) with increments of 0.010 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)

 

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

High Performance 10.0W Thermal GAP PAD Materials For Al Servers 0

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

 

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

연락처 세부 사항
Dongguan Ziitek Electronic Materials & Technology Ltd.

담당자: Dana Dai

전화 번호: 18153789196

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