|
|
제품 상세 정보:
결제 및 배송 조건:
|
| 제품명: | 5G 기지국을 위한 높은 열 전도성 15W/MK 부드러운 열 전도성 갭 필러 패드 | 열전도율: | 15.0W/mK |
|---|---|---|---|
| 경도: | 35 버팀목 00 | 밀도(g/cm3): | 3.25 |
| 키워드: | 열 패드 | 애플리케이션: | 5G 기지국 |
| 다이렉트릭 상수 @ 1MHz: | 8.0 | 화재 등급: | 94-V0 |
High Thermally Conductive 15W/MK Soft Thermally Conductive Gap Filler Pads For 5G Base Stations
Company pfofile
Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:
All products are compliant with UL94 V-0, SGS and ROHS standards.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
The TIF®800SE Series is a high-end compressible thermal pad that meets top-level cooling requirements while also ensuring excellent assembly workability. Through an innovative material formulation, it successfully achieves an ideal combination of ultra-high thermal conductivity and moderate hardness.This unique performance balance allows it to efficiently handle the cooling challenges posed by extremely high heat fluxes,kwhile álso possessing good mechanical_strength and compressibility, making it easy to manufacture and install. It provides a thermal interface material solution with both outstanding heat dissipation performance and high reliability for high-power-density electronic devices.
Features:
> Excellent thermal conductive 15.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Broad range of hardnesses available
> Outstanding thermal performance
> High tack surface reduces contact resistance
Applications:
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers
> Routers
> Medical Devices
> Auditioning electronic products
> Unmanned aerial vehicle(UAV)
> Photovoltaic
| Typical Properties of TIF®800SE Series | |||
| Property | Value | Test method | |
| Color | Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.25 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.030 | 0.040~0.200 | ASTM D374 |
| (0.75) | (1.00~5.00) | ||
| Hardness | 35 Shore 00 | 35 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 8.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 15W/m-K | ASTM D5470 | |
| 15W/m-K | ISO22007 | ||
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ:
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
담당자: Dana Dai
전화 번호: +86 18153789196
