Thermal Conductive Pad Silicone Based Soft Compressible Electrically Isolating Moldable For Complex Parts And Low Stress Applications
The TIF® 100-15-11F Series is a structurally supportive thermal pad designed to provide excellent heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat efficiently, and offers mechanical support for stacked components while resisting compressive deformation. This product is ideal for applications requiring a balance between heat dissipation, insulation, and mechanical stability.
Key Features
- Good thermal conductivity: 1.5W/mK
- Moldable for complex parts
- Soft and compressible for low stress applications
- Naturally tacky - no additional adhesive coating required
- Available in various thicknesses
- Broad range of hardness options
Applications
- Cooling components to chassis or frame
- High speed mass storage drives
- Heat sinking housing at LED-lit BLU in LCD
- LED TV and LED-lit lamps
- RDRAM memory modules
- Micro heat pipe thermal solutions
- Automotive engine control units
- Telecommunication hardware
- Handheld portable electronics
- Semiconductor automated test equipment (ATE)
- CPU cooling
- Display card thermal management
- Mainboard/motherboard applications
Typical Properties - TIF® 100-15-11F Series
| Property |
Value |
Test Method |
| Color |
Dark Gray |
Visual |
| Construction |
Ceramic filled silicone elastomer |
- |
| Density (g/cm³) |
2.2 |
ASTM D792 |
| Thickness Range (inch/mm) |
0.010~0.020" / 0.25~0.50mm
0.030~0.200" / 0.75~5.00mm |
ASTM D374 |
| Hardness (Shore 00) |
65 | 60 |
ASTM 2240 |
| Operating Temperature |
-40 to 200℃ |
- |
| Breakdown Voltage (V/mm) |
≥ 5500 |
ASTM D149 |
| Dielectric Constant @1Mhz |
4.5 |
ASTM D150 |
| Volume Resistivity (Ohm-meter) |
≥1.0×10¹² |
ASTM D257 |
| Thermal Conductivity (W/m-K) |
1.5 |
ASTM D5470 / ISO22007 |
| Fire Rating |
V-0 |
UL 94 (E331100) |
Product Specifications
Standard Thickness: 0.010" (0.25 mm) to 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm × 406 mm)
Component Codes
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Company Profile
Dongguan Ziitek Electronic Material Technology Co., Ltd., established in 2006, is a high-tech enterprise specializing in the research, development, production, and sales of thermal interface materials. Our product range includes thermal joint fillers, low melting point thermal interface materials, thermal insulators, thermal adhesive tapes, thermal interface pads, thermal greases, thermal plastics, silicone rubber, and silicone rubber foam.
Business Philosophy: "Survival by quality, development by quality"
We continue to provide the most efficient and best service for customers with excellent quality through our spirit of rigor, pragmatism, and innovation.
Factory Size: 8,000-10,000 square meters
Location: No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China
Customer Service:
Online-service: 12 hours daily, fastest inquiry response
Working Hours: 8:00am - 5:30pm, Monday to Saturday (UTC+8)
Well-trained English-speaking staff available for all inquiries
Standard export packaging or customized marking available
Free samples provided upon request
After-Sales Service
Even though our products undergo strict inspection, if you encounter any issues, please provide proof and we will help resolve the problem with a satisfactory solution.
Why Choose Us?
- Our value message: "Do it right the First time, total quality control"
- Core competency: Thermal conductive interface materials
- Competitive advantage products
- Confidentiality agreement and business secret contracts
- Free sample offers
- Quality assurance contracts
Korean
